JPH0635463Y2 - チップ部品 - Google Patents
チップ部品Info
- Publication number
- JPH0635463Y2 JPH0635463Y2 JP462589U JP462589U JPH0635463Y2 JP H0635463 Y2 JPH0635463 Y2 JP H0635463Y2 JP 462589 U JP462589 U JP 462589U JP 462589 U JP462589 U JP 462589U JP H0635463 Y2 JPH0635463 Y2 JP H0635463Y2
- Authority
- JP
- Japan
- Prior art keywords
- case
- insulating plate
- lead wire
- recess
- chip component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007789 sealing Methods 0.000 claims description 18
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 238000009413 insulation Methods 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 description 19
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- PCCVSPMFGIFTHU-UHFFFAOYSA-N tetracyanoquinodimethane Chemical compound N#CC(C#N)=C1C=CC(=C(C#N)C#N)C=C1 PCCVSPMFGIFTHU-UHFFFAOYSA-N 0.000 description 2
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000002048 anodisation reaction Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP462589U JPH0635463Y2 (ja) | 1989-01-19 | 1989-01-19 | チップ部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP462589U JPH0635463Y2 (ja) | 1989-01-19 | 1989-01-19 | チップ部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0296721U JPH0296721U (en]) | 1990-08-01 |
| JPH0635463Y2 true JPH0635463Y2 (ja) | 1994-09-14 |
Family
ID=31207300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP462589U Expired - Fee Related JPH0635463Y2 (ja) | 1989-01-19 | 1989-01-19 | チップ部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0635463Y2 (en]) |
-
1989
- 1989-01-19 JP JP462589U patent/JPH0635463Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0296721U (en]) | 1990-08-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |